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  ligitek electronics co.,ltd. property of ligitek only doc. no : qw0905- rev. : a date : - 2006 15 - feb. data sheet LBD2012-XX LBD2012-XX light bar led display
2.54x2=5.08 (0.2") 8.0(0.315") 7.49(0.295") pin no.1 12.7 (0.5") 5.08(0.2") ? 0.45 typ LBD2012-XX ligitek 6.35(0.25") 4.3 0.5 13.97 (0.55") note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. LBD2012-XX package dimensions part no. page1/6 ligitek electronics co.,ltd. property of ligitek only
anode nc 6 5 cathode anode 4 3 4 3 electrical connection pin no.1 ligitek electronics co.,ltd. property of ligitek only LBD2012-XX internal circuit diagram 2/6 page 1 2 LBD2012-XX 1 6 cathode np LBD2012-XX part no.
reverse current per any chip ir 10 a operating temperature storage temperature LBD2012-XX part no solder temperature 1/16 inch below seating plane for 3 seconds at 260 part selection and application information(ratings at 25) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. common cathode -25 ~ +85 -25 ~ +85 material gap green emitted chip (nm) p ( nm) common cathode or anode 56530 tstg t opr max. 2.6 1.72.1 min. typ. 3.055.0 min. typ. electrical vf(v)iv(mcd) iv-m 2:1 peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip forward current per chip absolute maximum ratings at ta=25 ratings ligitek electronics co.,ltd. property of ligitek only parameter pd i fp i f symbol unit ma ma mw 100 120 g 30 page3/6 LBD2012-XX part no.
vr=5v ir iv-m luminous intensity matching ratio symbol test condition for each parameter parameter luminous intensity per chip peak wavelength forward voltage per chip spectral line half-width reverse current any chip mcd iv p nm a nm unit vf volt if=10ma if=20ma if=20ma test condition if=20ma ligitek electronics co.,ltd. property of ligitek only page4/6 LBD2012-XX part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 5/6 LBD2012-XX part no.
part no.LBD2012-XX the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solder resistance test high temperature high humidity test thermal shock test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test test itemtest condition jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard description 6/6 page


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